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Bus integration board Product List

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Conduction Cooling XMC Multi-Bus Integrated Board

Consolidating multiple communications with XMC for harsh environments.

This is a conduction cooling type XMC avionics communication interface board. It can accommodate up to 8 modules and supports the integration and testing of multi-protocol communication even in harsh environments. 【Features】 ■ High-density configuration of up to 8 modules ■ High-speed data transfer with DMA support ■ Ruggedized/conformal compliant *For more details, please download the PDF or feel free to contact us.

  • Company:MAXET
  • Price:Other
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  • Bus integration board

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